Thermal and Thermo-mechanical Behavior of Internal Silver-diamond Heat Spreaders for Power Electronic Modules

Aitor Casado Ramoneda^1,2, Yvan Avenas¹, Rabih Khazaka², Cyrille Gautier², Toni Youssef²

1: Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, 38000 Grenoble, France; 2: Safran Tech, Electrical & Electronic Systems Research Group, 78772 Châteaufort, France

Holistic Thermal Management System Design, Testing, and Modeling for 300 kW IGBT-Based Inverter for Switched Reluctance Motor Drives

Mohamed Hefny¹, Ahmed Zaghlol², Kamal Vaghasiya¹, Rachit Pradhan¹, Mohamed Omar¹, Ali Emadi¹

1: McMaster Automotive Resource Centre (MARC)-McMaster University, Ontario, Canada; 2: Innovative Thermal Solutions (ITS), Ontario, Canada

Precise 3D Modelling of SiC Dies Temperature Oscillations for Lifetime Prediction of Power Modules Used in DC/AC Power Converters

Alexandre Marie¹, Bernardo Cougo², Loic Renaudie¹, Tresor Kaounodji Koladoum¹, Jean-Pierre Fradin¹

1: ICAM School of Engineering, Toulouse, France; 2: IRT Saint-Exupery, Toulouse, France

Thermo-Mechanical Investigations for PCB Assemblies Using Top-side Cooled Power Devices

Philip Matzick, Christian Mentin, Lukas Adelbrecht, Elisa Anes Romero, Roberto Petrella

Silicon Austria Labs, Austria

Numerical Investigation of a Novel Lid Design for Automotive HPC Cooling

Baris Erol¹, Daniel May¹, Bernhard Wunderle^1,2

1: Chemnitz University of Technology, Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany

Experimental Validation of Thermal-Adjoint Topological Optimization for Cooling Plate Design

Federico Piscaglia¹, Emanuele Gallorini¹, Federico Ghioldi¹, Alexandre Marie², Jean-Pierre Fradin², Jerome Helie³

1: Politecnico di Milano, Milan, Italy; 2: ICAM, Toulouse, France; 3: VITESCO Technologies, Toulouse, France

3D-Printed Direct Liquid Multi-Jet Impingement Cooling Solutions for Power Electronics in Electrified Automotive Transportation

Reza Moloudi¹, Bart Vandevelde¹, Willem Verleysen², Silke G. C. Cleuren², Lucie Masquelet³, Maik Sternberg⁴, Adrian Stelzer⁵, Andreas Burghardt⁶, Przemyslaw Jakub Gromala⁶

1: IMEC, Leuven, Belgium; 2: Materialise, Leuven, Belgium; 3: Sadechaf, Turnhout, Belgium; 4: Nanotest, Berlin, Germany; 5: Nano-Join, Berlin, Germany; 6: Bosch, Reutlingen, Germany

Lanczos-based Foster-to-Cauer Transformation for Network Identification by Deconvolution

Nils Jonas Ziegeler^1,2, Stefan Schweizer^1,3

1: South Westphalia University of Applied Sciences, Iserlohn, Germany; 2: Hella GmbH & Co. KGaA, Germany; 3: Fraunhofer Application Center for Inorganic Phosphors, Soest, Germany

Hotspot-aware Microfluidic Cooling for High TDP Chips Using Topology Optimization

Athanasios Boutsikakis, Emile Soutter, Miguel A. Salazar de Troya, Nicola Esposito, Dasha Mukasheva, Hanane Bouras, Remco van Erp

Corintis, Switzerland

Optimization of LHP (loop heat pipe) Geometry for Ultra-high Heat Flux Cooling System

Hee Soo Myeong¹, Seok Pil Jang^1,2

1: Department of Smart Air Mobility, Korea Aerospace University, Goyang-si, Korea, Republic of (South Korea); 2: Department of Aeropace and Mechanical Engineering, Korea Aerospace University, Goyang-si, Korea, Republic of (South Korea)

Thermal Characterization of Vertical GaN Based Power Devices

Sandra Fischer, Florian Mayer, Verena Leitgeb, Lisa Mitterhuber, Elke Kraker

Materials Center Leoben Forschung GmbH, Leoben, Austria

Thermal Numerical Modelling of Complex Electronic Devices

Sophie Salvadori, Mahmoud Ali, Viraj Singh, Amandine Battentier

Slb, France

Extracting Time-Constant Spectra by the Subspace Barzilai and Borwei Non-Negative Least Square Algorithm

Joosun Yun¹, Byongjin Ma², Guesuk Lee², Taehee Jung², Dong-Soo Shin³, Youngbeom Kim¹, Hyundon Jung¹

1: EtaMax, Korea, Republic of (South Korea); 2: KETI, Korea, Republic of (South Korea); 3: Hanyang University ERICA,Ansan-si, Republic of (South Korea)

ATARI: Advanced Thermomigration Analysis for Reliability-Aware Interconnects

Olympia Axelou, Eleni Tselepi, George Floros

University of Thessaly, Thessaly, Greece

A Case Study on Exhaust Airflow Rates by the Enclosure Ventilation Fan Structure of a Cast Resin Transformer

Seongeon Kim, Jaeseop Ryu

LS Electric, Korea, Republic of (South Korea)

Modelling Thermal Properties of Power LEDs Module

Krzysztof Górecki, Przemysław Ptak

Gdynia Maritime University, Gdynia, Poland

Numerical Investigation on the Thermal Resistance and Assembly Cost in SSC and DSC Power Modules

Ciro Scognamillo¹, Antonio Pio Catalano¹, Lorenzo Codecasa², Alberto Castellazzi³, Vincenzo d'Alessandro¹

1: University Federico II, Napoli, Italy; 2: Politecnico di Milano, Milan, Italy; 3: Kyoto University of Advanced Science, Kyoto, Japan

Electro-Thermal Characteristics Comparison for FinFET, NWFET and NSFET Structures

Konstantin O. Petrosyants, Denis S. Silkin, Dmitiy A. Popov

National Research University Higher School of Economics, Moscow, Russia

THERMEXP: An Efficient Thermal Analysis method via Matrix Exponential

Pavlos Stoikos, George Floros

University of Thessaly, Thessaly, Greece

Transient Thermal Simulation of a SiP FO-WLP Embedding a GaN Power Amplifier

N'doua Luc Arnaud Kakou¹, Raphael Sommet¹, Anass Jakani², Khalil Karrame¹, Laurent Brunel³, Vincent Bortolussi³, Benoit Lambert³, Jean-Christophe Nallatamby¹

1: XLIM; 2: III-V Lab; 3: UMS

Static Thermal Model of a Fibre-Optic Gyroscope

Marcin Janicki, Piotr Zając, Cezary Maj

Lodz University of Technology, Lodz, Poland