Conference Agenda

Thermal Transient Tests with Programmed Powering on Wide Bandgap Power Devices with Non-monotonous and Time-variant Characteristics

Sándor László Ress^1,2, Zoltán Sárkány¹, Márta Rencz^1,2, Gábor Farkas¹

1: SIEMENS DI SW, Budapest, Hungary; 2: Budapest University of Technology and Economics, Budapest, Hungary

Applicability of JESD51-14 to Clip-bonded, Discrete Power Devices

Szilárd Zsigmond Szőke, Henrik Sebők

Robert Bosch Kft., Hungary

Modular Design of Cold Plate for Cooling Power Module – Application to LV100 Packaging Module Silicon Carbide –

Wahid Cherief, Mickael Vahier, Mariya Pektova, Yannick Moison, Jérôme Giolat

MERSEN, France

An Advanced Cooling Solution for High Voltage and Power Density Modules

Amin Salim Al-Hinaai^1,2, Till Huesgen¹, Cyril Buttay², Eric Vagnon², Ettinger Ildiko³, Besar Asllani⁴, Céline Combettes⁵

1: Electronics Integration Laboratory, University of Applied Sciences Kempten, Germany; 2: Univ Lyon, CNRS, INSA Lyon, Université Claude Bernard Lyon 1, Ecole Centrale de Lyon, Villeurbanne, France; 3: CeramTec GmbH, Plochingen, Germany; 4: SuperGrid Institute, Villeurbanne, France; 5: Laboratoire plasma et conversion d'énergie, Toulouse, France

HexMG: A Circuit-Model Based Finite Multi-Domain Simulator

László Pohl

Budapest University of Technology and Economics, Hungary

Thermal Reduced Order Modelling of Multiple Power Modules on a Forced Air Heat Sink

Kajol Kulkarni, Pietro Botazzoli

Siemens AG, Germany

Discrete Packaged Power Diode’s Electro-thermal Behaviour Modelling Method in a Standard CAD Environment

Lilas Montaner¹, Achraf Kaïd², Fabrice Roqueta¹, Luc Hébrard², Jean-Baptiste Kammerer²

1: STMicroelectronics, France; 2: ICube-CNRS, Strasbourg, France

Analysis of Innovative Direct Coolers Manufacturable by Plastic 3D Printing for Modular Power Devices

Nicola Delmonte, Paolo Cova, Davide Spaggiari, Danilo Santoro, Corrado Sciancalepore, Roberto Menozzi

University of Parma, Italy

Analysis of the Performance of Different Packaging Technologies During Power Cycling Test

Bhanu Pratap Singh¹, Khaled Redwan Choudhury², Staffan Norrga¹, Konstantin Kostov³, Hans-Peter Nee¹

1: KTH Royal Institute of Technology, Sweden; 2: University of Warwick, UK; 3: Research Institutes of Sweden (RISE), Sweden

A Simple and Effective Power Derating Strategy Based on Junction Temperature Estimation Improving Both Performance and Reliability

Andrea Lamanuzzi, Andrea Pastore, Maurizio Tranchero, Claudio Romano, Paolo Santero

Ideas & Motion, Italy

Thermal Challenges in Design of Data Processing Electronics for Cubesats

Artur Jurkowski^1,2, Marcin Wójcik¹, Kamil Lysek¹

1: KP Labs Sp. z o.o., Poland; 2: Silesian University of Technology, Poland

Interplay of Thermal and Electronic Effects in the Mott Transition of Nanosized VO2 Phase Change Memory Devices

László Pósa^1,2, Péter Hornung¹, Tímea Nóra Török^1,2, Sebastian Werner Schmid², Sadaf Arjmandabasi², György Molnár¹, Zsófia Baji¹, Goran Dražić³, András Halbritter^2,4, János Volk¹

1: Centre for Energy Research, Hungary; 2: Department of Physics, Institute of Physics, Budapest University of Technology and Economics, Budapest, Hungary; 3: Department of Materials Chemistry, National Institute of Chemistry, Ljubljana, Slovenia; 4: ELKH-BME Condensed Matter Research Group, Budapest University of Technology and Economics, Budapest, Hungary

Thermal and Acoustics Investigation of a Combined Porous Media-piezoelectric Agitator System

Rutuja Ramchandra Bilaskar, Sripriya Ramamoorthy, Shankar Krishnan

IIT Bombay, India

A Study on Optimizing Cooling Design for a Power Transformer

Seong Eon Kim, Jae Seop Ryu

LS Electric, Korea, Republic of (South Korea)

Development and Evaluation of a Belt Drive Fatigue Tester for Accelerated Thermo-mechanical Stress Testing of Thin Metallic Films on Flexible Substrates

David Walther^1,, Nathanael Jöhrmann^1,, Jörg Arnold^1,, Bernhard Wunderle^1,2

1: Chemnitz University of Technology, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany

Enabling Short-Term Over-current Capability of SiC Devices using Microchannel Cooling

Shubhangi Bhadoria, Soundhariya G S, Hans-Peter Nee

KTH Royal Institute of Technology, Sweden

Optimization of Hollow Hybrid Fin Heat Sinks Under Natural Convection

Wooheon Noh, Kyoung Joon Kim

Pukyong National University, Korea, Republic of (South Korea)

Experimental Investigation of Pumped Two-phase Flow Boiling using Different Finned and Pin Fin Structures on Interchangeable Heater Modules

Ralph Schacht¹, Tobias Gruen², Daniel May³, Marcus Schulz⁴, Torsten Nowak⁵, Jörg Arnold⁶, Bernhard Wunderle⁷

1: Brandenburgische Technische Universität Cottbus-Senftenberg, Germany; 2: Berliner Nanotest und Design GmbH, Germany; 3: Technische Universität Chemnitz, Germany; 4: Berliner Nanotest und Design GmbH, Germany; 5: Berliner Nanotest und Design GmbH, Germany; 6: Technische Universität Chemnitz, Germany; 7: Technische Universität Chemnitz, Germany

Observer Based Junction Temperature Estimation: 3D Simulations and Experimentations

Tychique Kabwangala Nzalalemba¹, Jean-Pierre Fradin², Yassine Ariba³, Alexandre Marie², Frédéric Gouaisbaut⁴

1: LAAS-CNRS, Faculté d’ingénierie ULC-Icam, Kinshasa, D.R. Congo; 2: Icam site de Toulouse, Toulouse, France; 3: LAAS-CNRS, Université de Toulouse, CNRS, INSA, Toulouse, France; 4: LAAS-CNRS, Université de Toulouse, CNRS, UPS, Toulouse, France

A Simple Electrothermal Compact Model for SiC MPS Diodes Including the Snapback Mechanism

Vincenzo d'Alessandro, Vincenzo Terracciano, Alessandro Borghese, Marco Boccarossa, Andrea Irace

University of Naples Federico II, Italy

Improving the Thermal Ruggedness of GaAs HBTs Through Nonuniform Base Ballasting Optimization

Antonio Pio Catalano¹, Ciro Scognamillo¹, Peter J. Zampardi², Lorenzo Codecasa³, Vincenzo d'Alessandro¹

1: University Federico II, Naples, Italy; 2: Qorvo, Inc., Newbury Park, CA, USA; 3: Politecnico di Milano, Milan, Italy

Improved Nonlinear Electrothermal Simulation of Bipolar Transistors: Application to InP/InGaAs DHBTs

Ciro Scognamillo¹, Antonio Pio Catalano², Giuseppe Della Ragione¹, Markus Müller², Michael Schröter², Lorenzo Codecasa³, Vincenzo d'Alessandro¹

1: Department of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2: Chair for Electron Devices and Integrated Circuits (CEDIC), TU Dresden, Germany; 3: Department of Electronics, Information and Bioengineering, Politecnico di Milano, Milan, Italy

A Fast and Reliable Simulator for the Evaluation of Losses in Power Devices Based on a Mixed Analytical and Empirical Model

Lorenzo Giraudi, Maurizio Tranchero, Claudio Romano, Paolo Santero

Ideas & Motion, Italy

Performance Analysis of Stacked Photovoltaic-thermoelectric Generator using Mathematical Thermal-electrical Model

Ahmed I M Alnahhal^1,2, Balázs Plesz¹

1: Budapest University of Technology and Economics, Hungary; 2: University of Palestine, Palestine

Tridiagonal Approaches for Network Identification by Deconvolution

Nils J. Ziegeler^1,2, Peter W. Nolte³, Stefan Schweizer^1,3

1: South Westphalia University of Applied Sciences, Germany; 2: Hella GmbH & Co. KGaA, Germany; 3: Fraunhofer Application Center for Inorganic Phosphors, Branch Lab of Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany

Structure Curve Representation of Dynamic Thermal Multi-Ports

Lorenzo Codecasa¹, Vincenzo d'Alessandro², Antonio Pio Catalano², Ciro Scognamillo², Dario D'Amore¹

1: Politecnico di Milano, Milan, Italy; 2: Università Federico II, Naples, Italy

Accuracy Comparison of T3ster-master and Optimization-based Network Identification

Nils J. Ziegeler^1,2, Peter W. Nolte³, Stefan Schweizer^1,3

1: South Westphalia University of Applied Sciences, Germany; 2: Hella GmbH & Co. KGaA, Germany; 3: Fraunhofer Application Center for Inorganic Phosphors, Branch Lab of Fraunhofer Institute for Microstructure of Materials IMWS, Germany

Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements

Lorenzo Codecasa¹, Vincenzo d'Alessandro², Antonio Pio Catalano², Ciro Scognamillo², Dario D'Amore¹

1: Politecnico di Milano, Milan, Italy; 2: Università Federico II, Naples, Italy

Effect of Leading Edge Geometry on the Thermal Performance of Plate-fin Heat Sinks with Forced Convection at Transitional Reynolds Numbers

Gearóid Farrell¹, Rajesh Nimmagadda¹, Shailesh N. Joshi², Danny J. Lohan², Tim Persoons¹

1: Trinity College Dublin, Ireland; 2: Toyota Research Institute of North America (TRINA), USA

To Bend or Not to Bend: Impact on Heat Pipe Performance

Wessel W. Wits, Rick Groot, Davoud Jafari

University of Twente, Enschede, The Netherlands

Definition of a Common Parameter Set for Heterogeneous Heat Sink Shapes

Ine Vandebeek, Sarah da Silva Andrade, Lieven Vervecken, Yogesh Sovani

Diabatix, Belgium

Experimental Investigation Of an Ultra-thin Vapour Chamber With Water And Pure 2-Propanol as Working Fluids

Arunjoy Baruah, John Mathew, Shankar Krishnan

Indian Institute of Technology Bombay, India

Antigravity Heat Pipe with Multisectional Powder Wick

Victor Maziuk, Valery Aliakhnovich, Aliaxandar Ilyushchanka, Pawel Ancheuski

Powder Metallurgy Institute named after O.V. Roman, Belarus

Effect of Conductive Particle Networks on the Effective Thermal Conductivity of a Thermal Interface Material

Julia Lucia Mayer^1,2, Andreas Griesinger¹, Norbert Willenbacher²

1: Cooperative State University (DHBW) Stuttgart, Germany; 2: Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany

The Impact of Additively Fabricated Lattice Geometry on Liquid-cooling Heat Sink Performance for Railway Applications

Ahmad Batikh^1,2, Jean-Pierre Fradin¹, Antonio Castro Moreno³

1: Icam School of Engineering, Toulouse campus, France; 2: Institut Clément Ader (ICA), Toulouse, France; 3: IRT Saint Exupéry, Toulouse, France

Two-phase Cooling System for Electric Vehicles’ Battery Based on a 3D Pulsating Heat Pipe

Luca Cattani¹, Matteo Malavasi¹, Fabio Bozzoli¹, Valerio D'alessandro², Luca Giammichele², Alessandro Benelli¹

1: University of Parma, Italy; 2: Università Politecnica delle Marche, Italy

Investigation of Thermal Design Issues of a Bimaterial MEMS

Elemér Dávid Deák, Balázs Plesz, Péter Gábor Szabó

Budapest University of Technology and Economics, Hungary

CFD Modelling of the Heat Transfer of Photovoltaic Modules

Péter Pálovics, Márton Németh

Budapest University of Technology and Economics, Hungary

Alumina Ceramics Without Sintering Additives as Potential Substrates for Integrated Circuits

Katalin Balazsi, Mónika Furkó, Haroune R. Ben Zine, Tamás Kolonits, Csaba Balázsi

Centre for Energy Research, Hungary

3D Finite Element Modelling of Heat Transfer in Continuous Flow Two-phase Droplet Microfluidic Systems Using On-chip Thermal Control

Zsombor Szomor^1,2, Eszter L. Tóth¹, Péter Fürjes¹

1: Microsystems Lab., Inst. of Technical Physics and Materials Science, HUN-REN Centre for Energy Research, Hungary; 2: Doctoral School on Materials Sciences and Technologies, Óbuda University, Hungary

Comparison of Thermal Behaviour of Commercial Packages for Power Devices

Lorenzo Giraudi, Maurizio Tranchero, Claudio Romano, Paolo Santero

Ideas & Motion, Italy

SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis

Mahmoud Darwish, László Pohl

Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Műegyetem rkp. 3., H-1111 Budapest, Hungary

A Simple Self-exciting Vibration High Cycle Fatigue Tester for Accelerated Stress Testing of Thin Films

Arash Mohammadi¹, Majid Tavakolibasti¹, Jörg Arnold¹, Bernhard Wunderle^1,2

1: T.U. Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany

Optimising Impinging Microjet Arrays for Varying Heat Source Size in Liquid Cooled Coldplates

Jonathan William Elliott¹, Gerard Byrne¹, Anthony James Robinson^1,2

1: AMBER Research centre, Trinity College Dublin, Ireland; 2: School of Engineering, Trinity College Dublin, Ireland

Topology Optimization for the CFD Design of Heat Sinks Coupled with Phase Change Materials

Leonardo Abate¹, Nicola Bianco², Andrea Fragnito², Marcello Iasiello², Gerardo Maria Mauro¹

1: Università degli Studi del Sannio, Italy; 2: Università degli Studi di Napoli Federico II, Italy

A Machine Learning Model for the Detection of Solder Voids with Adjacent Sensors

Nils Jahn, Patrick Sina, Martin Pfost

TU Dortmund University, Germany

Reduced-order Model for Predicting Aerodynamic Performance of Dual Impeller Fans in Data Centre Cooling Systems

Wenguang Zhao, Sahan Wasala, Tim Persoons

Trinity College Dublin, Ireland

Thermal Robust Design Considerations for a Forced Convection Immersion Tank

Wendy Luiten

WLC, The Netherlands

AI-assisted Characterization of Cooling Patterns in a Water-cooled ICT Room

Vlatko Milic^1,2, Linus Kåge¹, Maria Andersson¹, Jim Enkel³, Bahram Moshfegh^1,2

1: Division of Energy Systems, Department of Management and Engineering, Linköping University, Linköping, Sweden; 2: Division of Building, Energy and Environment Technology, Department of Technology and Environment, University of Gävle, Gävle, Sweden; 3: Ericsson AB, Linköping Lab Operations, Linköping, Sweden

From Digital Twins to Use-cases: an Approach from AI-TWILIGHT

Genevieve Martin¹, Christophe Marty², Marc van der Schans¹, András Poppe³, Elke Kraker⁴

1: Signify, Eindhoven, The Netherlands; 2: Ingelux, Lyon, France; 3: Budapest University of Technology and Economics, Department of Electron Devices, Budapest, Hungary; 4: Materials Center Leoben Forschung GmbH, Leoben, Austria

Design of Power Cycling for Reliability Testing of LED Systems: Numerical and Analytical Approach

Lisa Mitterhuber, Julien Magnien, Elke Kraker

Materials Center Leoben Forschung GmbH, Austria

Automated Peak Detection for Analysis of Error Propagations and Validation of Structure Functions in Reliability Tests of LED Systems

Sandra Fischer, Julien Magnien, Heiko Röthl, Lisa Mitterhuber, Elke Kraker

Materials Center Leoben Forschung GmbH, Austria

On the Importance of Fast and Accurate LED Optical and Thermal Characterization: from Visible Use Cases to UV Technologies

Nicola Trivellin^1,2, Nicola Roccato², Francesco Piva², Matteo Buffolo², Carlo De Santi², Claudio Narduzzi², Riccardo Fraccaroli², Alessandro Caria², Gaudenzio Meneghesso², Enrico Zanoni², Matteo Meneghini^2,3

1: DII - University of Padova, Italy; 2: DEI - University of Padova, Italy; 3: Dept. of Physics and Astronomy - University of Padova, Italy

An Automated Method for Creating Compact Dynamic Thermal Models for In-situ Prognostics of Power Electronics and Power LED Packages

András Poppe, Gusztáv Hantos, János Hegedüs, Ferenc Ender

Budapest University of Technology and Economics, Department of Electron Devices, Budapest, Hungary

The Minimal Set of IVL Measurements to Characterize Power LED Chips

Márton Németh, Gusztáv Hantos, János Hegedüs

Budapest University of Technology and Economics, Department of Electron Devices, Hungary

Bayesian Experimental Design for LEDs Using Gaussian Processes

Peter Förster^1,2, Sebastian Schöps¹, Wil Schilders², Stephan Böckhorst³, Maximilian Mevenkamp³

1: Technical University of Darmstadt, Germany; 2: Eindhoven University of Technology, The Netherlands; 3: Hella GmbH & Co. KGaA, Germany

Transient Thermal Analysis for VCSEL Diodes

Maximilian Schmid¹, Marcel Momberg², Marcel Kettelgerdes², Gordon Elger¹

1: Fraunhofer IVI, Germany; 2: Technische Hochschule Ingolstadt, Germany

Impact of LED Temperature on the Performance of LiFi Optical Wireless Communication Links

Diego Rodolfo Vargas Romero¹, Jean-Paul M.G Linnartz^1,2, Jacobus L.M van Mechelen¹

1: Eindhoven University Technology, The Netherlands; 2: Signify (Philips Lighting) Research

Thermal Behavior of Crystalline Silicon Bottom Cell in a Monolithic Perovskite/Si Tandem Solar Cells

Ahmad Halal Alshahmani, Balázs Plesz

Budapest University of Technology and Economics, Hungary

Thermographic, Electric, and Spectral Measurements for Analysis of High-Power LEDs

Simon H. Anke¹, Nils J. Ziegeler^1,2, Peter W. Nolte³, Stefan Schweizer^1,3

1: South Westphalia University of Applied Sciences, Faculty of Electrical Engineering, Germany; 2: Hella GmbH & Co. KGaA, Thermal Management Department, Germany; 3: Fraunhofer Application Center for Inorganic Phosphors, Branch Lab of Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany

Thermal Test Vehicle for HPC – System Level Approach for Investigation of the Thermal Heat Path Signature with the Property of Spatial Resolution

Maik Sternberg¹, Daniel May^1,2, Kaushal Arun Pareek^1,2, Volker Bader⁴, Karl-Friedrich Becker⁴, Bernhard Wunderle^2,3, Mohamad Abo Ras¹

1: Berliner Nanotest und Design GmbH, Germany; 2: Chemnitz University of Technology, Germany; 3: Fraunhofer ENAS, Germany; 4: Fraunhofer IZM, Germany

Reliability Tests of the Surface-mounted Power MOSFETs Soldered using SAC0307-TiO2 Composite Solder Paste

Paweł Górecki¹, Adrian Pietruszka¹, Agata Skwarek¹, Balazs Illes²

1: Gdynia Maritime University, Poland; 2: Budapest University of Technology and Economics, Hungary