Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 18th July 2024, 04:23:28pm CEST

 
 
Session Overview
Session
P2: Poster introduction 2
Time:
Thursday, 28/Sept/2023:
11:50am - 12:20pm

Session Chair: Marta Rencz, Budapest University of Technology & Economics

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Presentations

Antigravity Heat Pipe with Multisectional Powder Wick

Victor Maziuk, Valery Aliakhnovich, Aliaxandar Ilyushchanka, Pawel Ancheuski

Powder Metallurgy Institute named after O.V. Roman, Belarus



Effect of Conductive Particle Networks on the Effective Thermal Conductivity of a Thermal Interface Material

Julia Lucia Mayer1,2, Andreas Griesinger1, Norbert Willenbacher2

1Cooperative State University (DHBW) Stuttgart, Germany; 2Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany



The Impact of Additively Fabricated Lattice Geometry on Liquid-cooling Heat Sink Performance for Railway Applications

Ahmad Batikh1,2, Jean-Pierre Fradin1, Antonio Castro Moreno3

1Icam School of Engineering, Toulouse campus, France; 2Institut Clément Ader (ICA), Toulouse, France; 3IRT Saint Exupéry, Toulouse, France



Two-phase Cooling System for Electric Vehicles’ Battery Based on a 3D Pulsating Heat Pipe

Luca Cattani1, Matteo Malavasi1, Fabio Bozzoli1, Valerio D'alessandro2, Luca Giammichele2, Alessandro Benelli1

1University of Parma, Italy; 2Università Politecnica delle Marche, Italy



Investigation of Thermal Design Issues of a Bimaterial MEMS

Elemér Dávid Deák, Balázs Plesz, Péter Gábor Szabó

Budapest University of Technology and Economics, Hungary



CFD Modelling of the Heat Transfer of Photovoltaic Modules

Péter Pálovics, Márton Németh

Budapest University of Technology and Economics, Hungary



Alumina Ceramics Without Sintering Additives as Potential Substrates for Integrated Circuits

Katalin Balazsi, Mónika Furkó, Haroune R. Ben Zine, Tamás Kolonits, Csaba Balázsi

Centre for Energy Research, Hungary



3D Finite Element Modelling of Heat Transfer in Continuous Flow Two-phase Droplet Microfluidic Systems Using On-chip Thermal Control

Zsombor Szomor1,2, Eszter L. Tóth1, Péter Fürjes1

1Microsystems Lab., Inst. of Technical Physics and Materials Science, HUN-REN Centre for Energy Research, Hungary; 2Doctoral School on Materials Sciences and Technologies, Óbuda University, Hungary



Comparison of Thermal Behaviour of Commercial Packages for Power Devices

Lorenzo Giraudi, Maurizio Tranchero, Claudio Romano, Paolo Santero

Ideas & Motion, Italy



SPICE Modeling of Insulator-Metal Transition Devices with Hysteresis

Mahmoud Darwish, László Pohl

Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Műegyetem rkp. 3., H-1111 Budapest, Hungary



A Simple Self-exciting Vibration High Cycle Fatigue Tester for Accelerated Stress Testing of Thin Films

Arash Mohammadi1, Majid Tavakolibasti1, Jörg Arnold1, Bernhard Wunderle1,2

1T.U. Chemnitz, Germany; 2Fraunhofer ENAS, Chemnitz, Germany



 
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