Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 17th July 2024, 06:32:19pm CEST

 
 
Session Overview
Session
P1: Poster introduction 1
Time:
Wednesday, 27/Sept/2023:
11:50am - 12:30pm

Session Chair: John Janssen, NXP Semiconductors

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Presentations

HexMG: A Circuit-Model Based Finite Multi-Domain Simulator

László Pohl

Budapest University of Technology and Economics, Hungary



Thermal Reduced Order Modelling of Multiple Power Modules on a Forced Air Heat Sink

Kajol Kulkarni, Pietro Botazzoli

Siemens AG, Germany



Discrete Packaged Power Diode’s Electro-thermal Behaviour Modelling Method in a Standard CAD Environment

Lilas Montaner1, Achraf Kaïd2, Fabrice Roqueta1, Luc Hébrard2, Jean-Baptiste Kammerer2

1STMicroelectronics, France; 2ICube-CNRS, Strasbourg, France



Analysis of Innovative Direct Coolers Manufacturable by Plastic 3D Printing for Modular Power Devices

Nicola Delmonte, Paolo Cova, Davide Spaggiari, Danilo Santoro, Corrado Sciancalepore, Roberto Menozzi

University of Parma, Italy



Analysis of the Performance of Different Packaging Technologies During Power Cycling Test

Bhanu Pratap Singh1, Khaled Redwan Choudhury2, Staffan Norrga1, Konstantin Kostov3, Hans-Peter Nee1

1KTH Royal Institute of Technology, Sweden; 2University of Warwick, UK; 3Research Institutes of Sweden (RISE), Sweden



A Simple and Effective Power Derating Strategy Based on Junction Temperature Estimation Improving Both Performance and Reliability

Andrea Lamanuzzi, Andrea Pastore, Maurizio Tranchero, Claudio Romano, Paolo Santero

Ideas & Motion, Italy



Thermal Challenges in Design of Data Processing Electronics for Cubesats

Artur Jurkowski1,2, Marcin Wójcik1, Kamil Lysek1

1KP Labs Sp. z o.o., Poland; 2Silesian University of Technology, Poland



Interplay of Thermal and Electronic Effects in the Mott Transition of Nanosized VO2 Phase Change Memory Devices

László Pósa1,2, Péter Hornung1, Tímea Nóra Török1,2, Sebastian Werner Schmid2, Sadaf Arjmandabasi2, György Molnár1, Zsófia Baji1, Goran Dražić3, András Halbritter2,4, János Volk1

1Centre for Energy Research, Hungary; 2Department of Physics, Institute of Physics, Budapest University of Technology and Economics, Budapest, Hungary; 3Department of Materials Chemistry, National Institute of Chemistry, Ljubljana, Slovenia; 4ELKH-BME Condensed Matter Research Group, Budapest University of Technology and Economics, Budapest, Hungary



Thermal and Acoustics Investigation of a Combined Porous Media-piezoelectric Agitator System

Rutuja Ramchandra Bilaskar, Sripriya Ramamoorthy, Shankar Krishnan

IIT Bombay, India



A Study on Optimizing Cooling Design for a Power Transformer

Seong Eon Kim, Jae Seop Ryu

LS Electric, Korea, Republic of (South Korea)



Development and Evaluation of a Belt Drive Fatigue Tester for Accelerated Thermo-mechanical Stress Testing of Thin Metallic Films on Flexible Substrates

David Walther1,, Nathanael Jöhrmann1,, Jörg Arnold1,, Bernhard Wunderle1,2

1Chemnitz University of Technology, Germany; 2Fraunhofer ENAS, Chemnitz, Germany



 
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