Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

Please note that all times are shown in the time zone of the conference. The current conference time is: 7th Aug 2022, 07:27:36pm IST

 
 
Session Overview
Date: Tuesday, 27/Sept/2022
9:00am
-
5:00pm
Short course Thermal design optimization
Date: Wednesday, 28/Sept/2022
8:00am
-
9:30am
Registration
9:30am
-
9:40am
Welcome address
Chair: Tim Persoons, Trinity College Dublin
9:40am
-
10:20am
Keynote speaker 1
10:20am
-
10:40am
Break
10:40am
-
11:40am
Session 1.1 Power Electronics
 

Development of a Realtime Physics Based Digital Twin for Online MOSFET Condition Monitoring in PV Converter Applications

Leander Van Cappellen1,3,4, Martijn Deckers2,4, Omid Alavi1,3,4, Michael Daenen1,3,4

1: IMO-IMOMEC, Hasselt University, Diepenbeek, Belgium; 2: KU Leuven Electa ESAT/ELECTA, KU Leuven, Heverlee, Belgium; 3: imec, Heverlee, Belgium; 4: EnergyVille, Genk, Belgium



Digital Twin Validation an Thermal Control Aspects in a Power Conversion Module

Wendy Luiten

WLC, Netherlands



Investigation of Groove Heat Pipe Embeded Cold Plate Design with Additive Manufacturing Thenologies

Vedat Yagci1,2, Murat Parlak1, Sertac Cadirci2

1: ASELSAN INC- REHIS-Engineering Division, Ankara, Turkey,; 2: Department of Mechanical Engineering, Istanbul Technical University, Istanbul, Turkey

11:40am
-
12:10pm
Poster introductions I
 

Micro-Mixers for Heat Transfer Enhancement in Electronics: a Review

Delara Soltani1, Tim Persoons2, Sajad Alimohammadi1,2

1: Technological University Dublin - City Campus, Dublin, Ireland; 2: Trinity College Dublin, Dublin, Ireland



Determining the Contribution of Spatial Sub-Regions to Structure Functions

Lorenzo Codecasa1, Vincenzo d'Alessandro2, Antonio Pio Catalano2, Ciro Sognamillo2, Dario D'Amore1

1: Politecnico di Milano, Milano, Italy; 2: University Federico II, Naples, Italy



Failure Analysis by Infrared and Thermoreflectance Imaging Applied on Active Devices

Daniel May1,2, Dominique Carisetti3, Ana Borta-Boyon3, Mohamad AboRas2, Afshin Ziaei3, Bernhard Wunderle1,4

1: TU Chemnitz, Chemnitz, Germany; 2: Berliner Nanotest & Design GmbH, Berlin, Germany; 3: Thales Research, Palaiseau, France; 4: Fraunhofer ENAS, Chemnitz, Germany



Thermal Management with Through Glass Vias for Next Generation Photonic Packages

Parnika Gupta

Tyndall National Institute, Cork, Ireland



Towards Quieter Air-cooling Systems: Rotor Self-noise Prediction for Axial Cooling Fans

Wenguang Zhao, Sahan Wasala, Tim Persoons

Trinity College Dublin, Dublin, Ireland



Analysis of the Thermal Behavior of a Li-Ion Pouch Battery Cell – Part I: Finite¬-Element Simulation Including the Entropic Coefficient

Marcello Iasiello1, Francesco Piccirillo1, Nicola Bianco1, Luigi Pio Di Noia2, Pierluigi Guerriero2

1: Dept. of Industrial Engineering, University Federico II, Naples, Italy; 2: Dept. of Electrical Engineering and Information Technology, University Federico II, Naples, Italy



Thermal Disturb TCAD Simulation of Phase Change Memory Device

Roberto Simola1, Paul Devoge1, Philippe Boivin1, Stephan Niel1, Roberto Gonella1, Andrea Redaelli2

1: STMicroelectronics, France; 2: STMicroelectronics, Italy



Thermal Performance of Miniature Vapour-Compression Refrigeration System for CPU Thermal Management

Fazeel Mohammed Naduvilakath Mohammed1,3, Gemma Murray1, Gerard Byrne1, Sara Battaglioli1,2,3, Michel Lebon2, Anthony James Robinson1,2,3

1: Trinity College Dublin, Dublin, Ireland; 2: Nexalus Ltd, Cork, Ireland; 3: CONNECT, Dunlop Oriel House, Trinity College, Dublin, Ireland



An Analysis of the Energy Infrastructure in Generic Data Centres

Younis Osama Abdelsalam1, Tim Persoons2, Sajad Alimohammadi1,2

1: Technological University Dublin - City Campus, Dublin, Ireland; 2: Trinity College Dublin, Dublin, Ireland



Accelerating the Thermal Transient Testing by a Novel Temperature Sensitive Parameter Calibration Method Based on I-V Characteristic Measurement

Sándor Ress1,2, Zoltán Sárkány2, Gábor Farkas2, Márta Rencz1,2

1: Budapest University of Technology and Economics, Budapest, Hungary; 2: Siemens DI SW STS, Budapest, Hungary



Design and Characterization of a Sealed Hybrid-cooled High Performance Computing Server

Michel Thonas Lebon1, Sara Battaglioli1,2,3, Richard Jenkins1, Ian Parry4, Anthony Robinson1,2,3

1: Nexalus, Nexalus, Ireland; 2: Dep. of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Dublin, Ireland; 3: CONNECT Centre, Dunlop Oriel House, Trinity College Dublin, Dublin, Ireland; 4: OCUK Ltd, Newcastle-under-Lyme, UK



Model Order Reduction of a Nonlinear Model of an Electronic Component: Application to a Microchip Activated by 4 Sources

Fatme Mustapha1,2, Valentin Bissuel1, Frédéric Joly2, Olivier Quéméner2

1: Thales Global Services SAS, Conflans-Sainte-Honorine, France; 2: Laboratoire de Mécanique et d’Energétique d’Evry, Evry,France



Additively Manufactured Lattice Structure Heat Sink for Railway Power Electronics Liquid Cooling

Ahmad Batikh1, Jean-Pierre Fradin1, Antonio Castro Moreno2

1: ICAM Toulouse, Toulouse, France; 2: IRT Saint Exupéry Toulouse, Toulouse, France



Experimental Investigation on Confined Impinging Round Jets in Aluminum Foam for Thermal Control

Bernardo Buonomo, Oronzio Manca, Sergio Nappo, Sergio Nardini

Universita' degli Studi della Campania "Luigi Vanvitelli", Caserta CE, Italy



Noise Attenuation Through Optimised Acoustic Metamaterials: A Low Form Factor Design for Targeted Noise Reduction

Oluwaseyi Ayotunde Ogun, John Kennedy

Trinity College Dublin, Dublin, Ireland



Thermal Modeling of Embedded Microscale Channel Structures Realized in Heterogeneous Packaging

György Bognár, Gábor Takács, Péter Gábor Szabó

Budapest University of Technology and Economics, Budapest, Hungary



Experimental Study on the Thermohydraulic Performance of Oil-Cooled Heat Sinks for Power Electronics

Jana Rogiers1,2, Ilya T'Jollyn1,2, Thomas Schoonjans1,2, Jasper Nonneman1,2, Michel De Paepe1,2

1: Ghent Universtity, Ghent, Belgium; 2: FlandersMake@UGent corelab EEDT-MP, Ghent, Belgium



Acoustic Noise Insulation for Air-cooled Data Centre Hard Disk Drive Enclosures: Effect on Thermal Management

Sahan Wasala1, Lon Stevens2, Raye Sosseh3, Tim Persoons1

1: Trinity College Dublin, Dublin, Ireland; 2: Seagate US LLC, Longmont, USA; 3: Seagate US LLC, Shakopee, USA



Comparison of Different Formulations for The Dual-Phase-Lag Heat Conduction Model

Artur Sobczak, Grzegorz Jablonski, Marcin Janicki

Lodz University of Technology, Lodz, Poland



SPICE Model Extension to Simulate the Transient Coupled Electro-Thermal Behaviour for Several Power Electronic components on System Level - Modelling Approach and Experimental Validation

Gregor Wiedemann, Ralph Schacht

Brandenburgische Technische Universität Cottbus-Senftenberg, Cottbus, Germany



Application of Lévêque Analogy to Open Cellular Solids

Sanjeet Kumar, Sripriya Ramamoorthy, Shankar Krishnan

Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India



Flow-through Porous Finned Heat Sinks with Helmholtz Resonators for Combined Heat Dissipation and Tonal as well as Broadband Noise Reduction

Akshay Wagh, Harshavardhan Ronge, Radhika Choudhary, Shankar Krishnan, Sripriya Ramamoorthy

Department of Mechanical Engineering, Indian Institute of Technology, Bombay, India



Analysis of Impact Ionization Effect on Power RF N-LDMOS Reliability under Thermal RF Life Test

Mohamed Ali Belaid

LATIS-ENISo, Sousse Erriadh, Tunisia

12:10pm
-
1:30pm
Lunch / Poster session 1
1:30pm
-
2:50pm
Session 1.2 Convective single phase
 

High Heat Flux Removal by Water Jet Impingement using 3D Printed Nozzles

Ram Gopal Varma Ramaraju1, Mohammad Passandideh Fard1,2, Sanjeev Chandra1

1: University of Toronto, Canada; 2: Ferdowsi University of Mashhad, Iran



Parametric Investigation of Inlet Pressure and Diffuser Angle Impact on Adjustable Air Amplifier Performance

Eoin Hendrikus Oude Essink1,2,3, Tim Persoons2,3, Sajad Alimohammadi1,2,3

1: Technological University Dublin, Dublin, Ireland; 2: Trinity College Dublin, Dublin, Ireland; 3: MaREI, SFI Research Centre for Energy, Climate and Marine, Environmental Research Institute, Cork, Ireland



Heat Transfer Enhancement In A Minichannel Due To Asymmetric Sinusoidal Pulsating Flows

Parth Kumavat1, Sajad Alimohammadi2, Seamus M. O'Shaughnessy1

1: University of Dublin, Trinity College, Dublin, Ireland; 2: Technological University Dublin, Dublin, Ireland



Experimental Investigation of the Heat Transfer Characteristics Associated with Dual Jet Cooling

Paula Jane Murphy1, Sajad Alimohammadi2, Séamus O'Shaughnessy1

1: Trinity College Dublin, Dublin, Ireland; 2: Technological University Dublin,Ireland

2:50pm
-
3:10pm
Vendor session 1
3:10pm
-
3:30pm
Break
3:30pm
-
4:50pm
Session 1.3 Packaging
 

Thermal Investigations for High Power Density Onboard Charger Applications

Christian Mentin, Ismail Recepi, Philip Matzick

Silicon Austria Labs, Graz, Austria



Accelerated Stress Testing and Failure Analysis of Thermal Greases

Bernhard Wunderle1, Daniel May1, Jörg Arnold1, Mohamad Abo Ras2

1: TU Chemnitz, Chemnitz, Germany; 2: Berliner Nanotest & Design GmbH, Berlin, Germany



A Novel Integrated Cooling Packaging for High Power Density Semiconductors

Amin Salim Obaid Al-Hinaai1,2, Cyril Butty1, Till Huesgen2, Daniela Meyer3, Richard Zeitler3

1: Electronics Integration Laboratory, University of Applied Sciences Kempten, Kempten, Germany; 2: Univ Lyon, CNRS, INSA Lyon, Université Claude Bernard Lyon 1, Villeurbanne, France; 3: CeramTec GmbH, Plochingen, Germany

5:00pm
-
5:30pm
Walk to Trinity College
5:30pm
-
7:30pm
Welcome reception The Atrium, Trinity College
Date: Thursday, 29/Sept/2022
8:40am
-
9:20am
Keynote speaker 2
9:20am
-
10:20am
Session 2.1 Thermal Materials and Reliability
 

Thermal Conductivity Measurements of Thermal Interface Materials Using the Bidirectional 3-Omega Method

Corinna Grosse-Kockert1, Mohamad Abo Ras1, Daniel May1,2, Bernhard Wunderle2

1: Berliner Nanotest und Design GmbH, Berlin, Germany; 2: Technische Universität Chemnitz, Chemnitz, Germany



Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data

Joseph Hermann1, Maximilian Schmid2, Gordon Elger1

1: TU Ingolstadt, Ingolstadt, Germany; 2: Fraunhofer IVI, Ingolstadt, Germany



Accelerated Stress Testing for High-Cycle Fatigue of thin Al Films on piezo-driven MEMS Cantilever

Nathanael Jöhrmann1, Chris Stöckel1,2, Bernhard Wunderle1,2

1: TU Chemnitz, Chemnitz, Germany; 2: Fraunhofer ENAS, Chemnitz, Germany

10:20am
-
10:40am
Break
10:40am
-
11:40am
Session 2.2 Advanced Manufacturing
 

FEM Analysis of 3D Printable Finned Metal Liquid Cold Plates for Semiconductor Power Modules

Paolo Cova1, Nicola Delmonte1, Davide Spaggiari1, Marco Portesine2, Federico Portesine2, Roberto Menozzi1

1: University of Parma, Parma, Italy; 2: Poseico S.p.A., Genua, Italy



Metal-based Direct Multi-jet Impingement Cooling Solution for Autonomous Driving High-Performance Vehicle Computer (HPVC)

Reza Moloudi1, Bart Vandevelde1, Daniel May2, Tobias Grün2, Majid Nazemi3, Willem Verleysen3

1: IMEC, Leuven, Belgium; 2: TU Chemnitz, Chemnitz, Germany; 3: Materialise, Leuven, Belgium



Improving the Performance of Flat Heat Pipes by Exploiting Benefits of Additive Manufacturing

Davoud Jafari, Wessel W. Wits

University of Twente, Enschede, Netherlands

11:40am
-
12:10pm
Poster introductions II
 

Numerical Investigation on Thermal Behaviour of Horizontal Plate Heat Sink with Metal Foam Fins and PCM for Passive Cooling System

Dario Baldassano, Bernardo Buonomo, Oronzio Manca, Alessandro Merenda

Universita' degli Studi della Campania "Luigi Vanvitelli", Caserta CE, Italy



Enhancement of an Open Compute Project (OCP) Server Thermal Management and Waste Heat Recovery Potential via Hybrid Liquid-cooling

Sara Battaglioli1,2,3, Michel Lebon2, Richard Jenkins2, Jon Summers4, Jeffrey Sarkinen4, Anthony J. Robinson1,2,3

1: Dep. of Mechanical, Manufacturing & Biomedical Engineering, Trinity College Dublin, Dublin, Ireland; 2: Nexalus Labs, Water St, Loughanalla, Castlepollard, Ireland; 3: CONNECT Centre, Dunlop Oriel House, Trinity College Dublin, Dublin, Ireland; 4: RISE, Research Institutes of Sweden, Luleå, Sweden



Reliable Force Field Potential for Thermal Transport in AlN

Simon Christopher Fernbach1, Elke Kraker1, Natalia Bedoya-Martínez1, Egbert Zojer2

1: MCL, Leoben, Austria; 2: TU Graz, Graz, Austria



Effects of Wetting Behaviours and Contact Resistance on Thermal and Rheological Characteristics of Thermal Interface Materials

Julia Lucia Mayer1,2, Andreas Griesinger1, Norbert Willenbacher2

1: DHBW Stuttgart, Stuttgart, Germany; 2: Karlsruher Institute of Technology, Karlsruhe, Germany



Beyond Fourier Thermal Management at the Nanoscale

Paul Desmarchelier1, Efstratios Nikidis2, Joseph Kioseoglou2, Anne Tanguy3,4, Konstantinos Termentzidis1

1: CNRS, CETHIL UMR5008, Université Claude Bernard Lyon 1, Villeurbanne, France; 2: Physics Department, Aristotle University of Thessaloniki,Thessaloniki, Greece; 3: Univ Lyon, INSA Lyon, CNRS, France; 4: ONERA, University Paris-Saclay, Chemin de la Hunière, Palaiseau, France



Compact SPICE Models of Sub-100 nm FDSOI and FinFET Devices in the Wide Temperature Range (-269°C…+300°C)

Konstantin O. Petrosyants1,2, Mamed R. Ismail-zade1, Lev M. Sambursky1,2

1: National Research University Higher School of Economics, Moscow Institute of Electronics and Mathematics, Moscow, Russia; 2: Institute for Design Problems in Microelectronics of Russian Academy of Sciences, Moscow, Russia



The Effect of Dimming Frequency on the Aging of Power LEDs

Gusztáv Hantos, János Hegedüs, András Poppe, Máté Lukács, Bence Bodnár

Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Budapest, Hungary



Investigation of Nanostructured Materials of Topography Free Surface by Scanning Thermal Microscopy

Nathaly Chaaraoui, Nathalie Trannoy, Maher Jandah

Université de Reims Champagne Ardenne, Reims, France



Experimental Investigation of a Novel Direct Rotor Cooling Method for an Interior Permanent Magnet Synchronous Machine

Jasper Nonneman1,2, Ieuan Evans1, Ilya T'Jollyn1,2, Steven Vanhee1,3, Michel De Paepe1,2

1: Department of Electromechanical, Systems and Metal Engineering, Ghent University, Ghent, Belgium; 2: Flanders Make@UGent – Core lab EEDT-MP, Ghent, Belgium; 3: Dana Belgium NV, Brugge, Belgium



Thermal Transient Testing Alternatives for the Characterisation of GaN HEMT Power Devices

Zoltan Sarkany1, Mattia Musolino2, Alessandro Sitta2, Michele Calabretta2, Gabor Farkas1, Marta Rencz1

1: Siemens DI SW STS, Budapest, Hungary; 2: STMicroelectronics S.p.A, Agrate Brianza MB, Italy



The Impact of Roughness Parameters on Laminar Convective Heat Transfer Applied to Additive Manufactured Minichannels

Mohammadreza Kadivar1,2, David Tormey1,2, Gerard McGranaghan1,2

1: Centre for Precision Engineering Material and Manufacturing Research (PEM Centre), Atlantic Technological University, Sligo, Ireland; 2: I-Form, The SFI Advanced Manufacturing Research Centre, Dublin, Ireland



Immersion Cooling of Lithium-ion Batteries for Electric Vehicles

Niall Patrick Williams, Séamus O'Shaughnessy

Trinity College Dublin, Dublin, Ireland



J-Fraction Approach for Calculating Thermal Structure Functions

Nils J. Ziegeler1, Peter W. Nolte2, Stefan Schweizer1,2

1: Faculty of Electrical Engineering, South Westphalia University of Applied Sciences, Soest, Germany; 2: Fraunhofer Application Center for Inorganic Phosphors, Branch Lab of Fraunhofer IMWS, Soest, Germany



Thermal Characterization Issues of LEDs during Reliability Testing

János Hegedüs, Gusztáv Hantos, András Poppe, Máté Lukács, Bence Bodnár

Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Budapest, Hungary



Mutual Thermal Couplings in Selected Networks with Power LEDs

Krzysztof Górecki1, Przemysław Ptak1, Marcin Janicki2

1: Gdynia Maritime University, Gdynia, Poland; 2: Politechnika Łódzka, Łódź, Poland



Performance Analysis of Perovskite Solar Cell by Considering Temperature Effect on the Physical Parameters of the Absorber Layer using Numerical Simulation

Ahmad Halal1, Ahmed Issa Alnahhal1,2, Balázs Plesz1

1: Budapest University of Technology and Economics, Budapest, Hungary; 2: University of Palestine, Ghazah, Palestine



Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package

Eric Monier-Vinard, Najib Laraqi

Paris Nanterre University, Paris, France



Boiling on MuSEP Coated Die with a Novel Two-Phase Cooling Prototype for Microprocessors

Yaser Nabavi Larimi1, Omidreza Ghaffari1, Mikael Labrecque1, Francis Grenier2, Simon Jasmin2, Luc Fréchette1, Julien Sylvestre1

1: 3IT- Université de Sherbrooke, Sherbrooke, Canada; 2: Systemex Energies Inc, Laval, Canada



Study of Two-phase Microchannel Heat Sink Fabricated by A.M. Technology

Nan Chen1, Yunshui Chen2, He Zhao3

1: Advanced Liquid Cooling Technologies; 2: Airsys Cooling Technologies; 3: Airsys Singapore



Including Transistor-level Hotspots in Standard Parameters and Models

Patrick Elebert

Analog Devices, Inc., Limerick, Ireland



Numerical Modelling of a Sessile Droplet under the Influence of External Fields

Samuel Berry1, Cormac Young2, Sidharth P. Raut1, Seamus O'Shaughnessy2, Anthony Robinson2, Sajad Alimohammadi1,2

1: TU Dublin, Dublin, Ireland; 2: Trinity College Dublin, Dublin, Ireland



Thermal-Electrical Model of Concentrated Photovoltaic-Thermoelectric Generator Combined System for Energy Generation

Ahmed Issa Alnahhal1,2, Ahmad Halal1, Balazs Plesz1

1: Budapest University of Technology and Economics, Budapest, Hungary; 2: University of Palestine, Ghazah, Palestine



Thermal-Hydraulic Characterization of Electronics Cooling Liquids: A Case Study of Jet Impingement Coldplate on Emulated CPU

Jonathan William Elliott1, Gemma Murray1, Richard Jenkins2, Gerard Bryne1, Anthony James Robinson1,2

1: Trinity College Dublin, Dublin, Ireland; 2: Nexalus Ltd., Cork, Ireland.



Mass-Diffusivity Determination of Four Tropical Wood used in Benin

Carlos Alain Houngbeme1, Armand Djossou1, Aristide Houngan1,2

1: Energy and Applied Mechanics Laboratory (LEMA); 2: Multidisciplinary Research Laboratory for Technical Education (LARPET) ENSET Lokossa, Brnin

12:10pm
-
1:30pm
Lunch / Poster session 2
1:30pm
-
2:50pm
Session 2.3 Thermal Measurements and Characterisation I
 

Void Detection in the Solder Layer between Power Semiconductor and PCB

Nils Jahn, Martin Pfost

TU Dortmund University, Dortmund, Germany



Raman Thermometry Characterization of GeSbTe Based Phase Change Materials

Akash Rajendra Patil1,2, Yannick Le-Friec2, Jury Sandrini2, Roberto Simola3, Philippe Boivin3, Emmanuel Dubois1, Jean-François Robillard1

1: Univ. Lille, CNRS, Centrale Lille, Junia, Univ. Polytechnique Hauts-de-France, UMR 8520 - IEMN – Institut d’Electronique de Microélectronique et de Nanotechnologie, Lille, France; 2: STMicroelectronics, Crolles, France; 3: STMicroelectronics, Rousset, France



Experimental Three-dimensional Thermal Mapping of a GaN on RF-SOI Chip

Isaac Haïk Dunn1, Tuyen Duc Nguyen1, Elyes Nefzaoui1, Jérôme Loraine2, Imene Lahbib2, Georges Hamaoui1, Brice Grandchamp2, Philippe Basset1, Gregory U’Ren2

1: ESYCOM lab, CNRS, France; 2: X-FAB France, Corbeil-Essonnes, France



Laser Stimulated Transient Thermal Analysis of Semiconductors

Hannes Schwan1, Maximilian Schmid2, Gordon Elger1

1: Technische Hochschule Ingolstadt, Ingolstadt, Germany; 2: Fraunhofer IVI, Dresden, Germany

2:50pm
-
3:10pm
Vendor session 2
3:10pm
-
3:30pm
Break
3:30pm
-
4:50pm
Session 2.4 Thermal Measurements and Characterisation II
 

Thermo-electric Characterization of GST Materials for Smart Environment

Gian Guido Gentili1, Misagh Khosronejad1, D'Asta Cristina1, Codecasa Lorenzo1, Squillantini Lorenzo1, Draghi Lorenza1, Nobili Luca1, Spagnolini Umberto1, Resteghini Laura2, Milani Angelo2, Mazzucco Christian2

1: Politecnico di Milano, Milano, Italy; 2: Huawei Technology Italia



Concepts for High throughput LED Testing and High-speed Optical Transients of LEDs

András Poppe1, János Hegedüs1, Gusztáv Hantos1, Péter Csuti2

1: Department of Electron Devices, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, Budapest, Hungary; 2: LightingLab Calibration Laboratory Ltd., Veszprém, Hungary



Analytical Modeling and Numerical Simulation of Nonlinear Thermal Effects in Bipolar Transistors

Vincenzo d'Alessandro1, Ciro Scognamillo1, Antonio Pio Catalano1, Markus Müller2, Michael Schröter2, Peter Joseph Zampardi3, Lorenzo Codecasa4

1: University Federico II, Naples, Italy; 2: TU Dresden, Dresden, Germany; 3: Qorvo, USA; 4: Politecnico di Milano, Milano, Italy



Analysis of the Thermal Behavior of Li-Ion Pouch Battery Cell - Part II: Circuit-based Modeling for Fast and Accurate Thermo-Electrochemical Simulation

Antonio Pio Catalano1, Ciro Scognamillo1, Francesco Piccirillo2, Pierluigi Guerriero1, Vincenzo d'Alessandro1, Lorenzo Codecasa3

1: Dept. of Electrical Engineering and Information Technology, University Federico II, Naples, Italy; 2: Dept. of Industrial Engineering, University Federico II, Naples, Italy; 3: Politecnico di Milano, Milano, Italy

6:45pm
-
7:15pm
Coach The Alex -> Guinness
7:30pm
-
11:00pm
Visit and gala dinner in Guinness Storehouse
11:00pm
-
11:30pm
Coach Guinness -> The Alex
Date: Friday, 30/Sept/2022
9:00am
-
9:40am
Keynote speaker 3
9:40am
-
10:40am
Session 3.1 Design and Simulation I
 

Extraction of Thermal Models for EM Analysis at Advanced Nodes

Ron Martin1, Aravind Vadakkekoithuruthil1, Christoph Sohrmann1, Volkhard Beyer1, Avi Debnath2, Hendrik Mau2

1: Fraunhofer IIS, Engineering of Adaptive Systems EAS, Dresden, Germany; 2: GlobalFoundries Dresden, Germany



Sensitivity Analysis and Uncertainty Quantification of Data Processing Unit Thermal Model Dedicated for Micro-satellite Space Mission

Artur Jurkowski1,2, Radosław Paluch1, Marcin Wójcik1, Adam Klimanek2

1: KP Labs, Gliwice, Poland; 2: Silesian University of Technology, Gliwice,Poland



Design Optimization of Micro-Thermoelectric Cooler for Thermal Management using Finite Element Simulations

Rajvinder Kaur, Amit Tanwar, Parnika Gupta, N. Padmanathan, Peter O'Brien, Kafil Mahmood Razeeb

Tyndall National Institute, University College Cork, Cork, Ireland

10:40am
-
11:00am
Break
11:00am
-
12:40pm
Session 3.2 Convective two-phase I
 

Thermal Testing of Arrays of PHP Finned Plates for Enhanced Air-Cooling of Electronics

Enzo Minazzo1, Gautier Rouaze1, Jackson B. Marcinichen1, John R. Thome1, Kangning Xiong2, L. Winston Zhang2

1: JJ Cooling Innovation Sàrl, Lausanne, Switzerland; 2: Novark Industries, Shenzhen, China



3D Metal Printed Pulsating Heat Pipe: Comparison of Test Data to Inhouse Numerical 1D Transient Simulation Code

Gautier Rouaze1, Haris Constantinou2, Sébastien Lani3, John R. Thome1

1: JJ Cooling Innovation Sàrl, Lausanne, Switzerland; 2: CERN, Meyrin, Switzerland; 3: SIPPB, Bienne, Switzerland



Nucleate Pool Boiling Regimes Of Power Electronics Cooling

Ilya T'Jollyn1,2, Jasper Nonneman1,2, Wim Beyne1, Michel De Paepe1,2

1: Department of Electromechanical, Systems and Metal Engineering, Ghent University, Ghent, Belgium; 2: FlandersMake@UGent – Core lab EEDT-MP, Ghent, Belgium



Simulation and Experimental Investigation of Single and Two-phase Cold Plate Using HFE 7100 with Discrete Heat Sources

Ammar Osman, Yogendra Joshi

Georgia Institute of Technology, Atlanta, USA



Numerical Simulations of Conjugate Heat Transfer Effects on Single- and Two-Phase Cooling via Multi-Microchannels Heat Sinks

Mirco Magnini1, Federico Municchi2

1: University of Nottingham, Nottingham, United Kingdom; 2: Colorado School of Mines, Golden, USA

12:40pm
-
1:40pm
Lunch
1:40pm
-
3:20pm
Session 3.3 Convective two-phase II
 

Thermophysical Characterization of a Sessile Evaporating Droplet for Efficient Thermal Management of Electronic Devices

Sidharth Priye Raut1,2, Michael J. Gibbons2, Seamus M. O'Shaughnessy2, Anthony J. Robinson2, Sajad Alimohammadi1,2

1: Technological University Dublin, Dublin, Ireland; 2: Trinity College Dublin, Dublin, Ireland



Evaluation of the Performance of a Magnetic Shuttle Micropump in a Two-phase Mechanical Pumping Loop

Valeria Nico1, Barry O'Donovan2, Eric Dalton1

1: University of Limerick, Limerick, Ireland; 2: ASML, Leixlip, Ireland



Time-Resolved Measurement of Enhanced Phase Change by a Fiber in an Oscillating Two-Phase Plug Flow

Nooshin Karami, Albert Tessier-Poirier, Alihossein Nikkhah, Etienne Leveille, Luc Frechette

Laboratoire Nanotechnologies et Nanosystèmes, LN2 CNRS, Université de Sherbrooke, 3IT (Institut Interdisciplinaire d’Innovation Technologique), Sherbrooke, QC, Canada



Review on Flow Boiling Patterns in Microchannels

Joseph J Widgington, Atanas Ivanov, Tassos G Karayiannis

Brunel University London, London, United Kingdom



Pushing the Limits of Air Cooling with Novel Two-Phase Prototypes for High Power Microprocessors

Omidreza Ghaffari1, Manuel Vincent1, Yaser Nabavilarimi1, Francis Grenier2, Simon Jasmin2, Luc Fréchette1, Julien Sylvestre1

1: Institut Interdisciplinaire d’Innovation Technologique (3IT)-, Université de Sherbrooke ,Sherbrooke, Canada; 2: Systemex Energies Inc. Laval, Canada

3:20pm
-
3:40pm
Break
3:40pm
-
4:00pm
Awards & closing remarks
Chair: Tim Persoons, Trinity College Dublin
Chair: John Janssen, NXP Semiconductors

 
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