Conference Agenda

Overview and details of the sessions of this conference. Please select a date or location to show only sessions at that day or location. Please select a single session for detailed view (with abstracts and downloads if available).

 
Session Overview
Date: Wednesday, 25/Sep/2019
8:00am
-
8:45am
Registration
8:45am
-
9:00am
Welcome
Session Chair: Lorenzo Codecasa, Politecnico di Milano
Session Chair: Vincenzo d'Alessandro, University Federico II
Session Chair: Claudio Maria Villa, ST Microelectronics
9:00am
-
9:45am
Keynote 1: Synthesis and Analysis of Wide-band-gap Based Integrated Power Electronics: Enabling Exploitation of Higher Temperature Capability by Bespoke Models and Design Tools
Chair: Lorenzo Codecasa, Politecnico di Milano

Alberto Castellazzi | Kyoto University of Advanced Science (KUAS)
9:45am
-
11:05am
S_01: Advances in Thermal Modeling and Simulation 1
Chair: John Parry, Mentor Graphics
11:05am
-
11:30am
Coffee break
11:30am
-
1:10pm
S_02: Cooling Approaches for Devices and Packages 1
Chair: Vadim Tsoi, Huawei Technologies Sweden AB
1:10pm
-
2:10pm
Lunch
2:10pm
-
3:10pm
Vendor Session
3:10pm
-
4:30pm
P1: Poster Session A
Chair: Joan Yu, Signify
Chair: Ari Glezer, Georgia Institute of Technology
4:30pm
-
5:10pm
Coffee break and Poster Viewing
5:10pm
-
6:30pm
S_03: Advanced Thermal Measurement Strategies 1
Chair: Gabor Farkas, Mentor Graphics MAD MicReD Division
6:30pm
-
7:30pm
Poster Viewing Session & Cocktails
Date: Thursday, 26/Sep/2019
8:45am
-
9:30am
Keynote 2: Thermal Considerations in Handset Power Amplifier Technology and Modules
Chair: Vincenzo d'Alessandro, University Federico II

Pete Zampardi | Qorvo
9:30am
-
11:10am
S_04A: Thermal Management in Power Electronics
Chair: Vincenzo d'Alessandro, University Federico II
S_04B: Thermal Management of LEDs
Chair: Marta Rencz, Budapest University of Technology & Economics
11:10am
-
11:30am
Coffee break
11:30am
-
12:50pm
S_05: Cooling Approaches for Devices and Packages 2
Chair: Yogendra Joshi, Georgia Instititute of Technology
12:50pm
-
1:50pm
Lunch
1:50pm
-
2:45pm
P2: Poster Session B
Chair: Wendy Luiten, WLC
Chair: John Janssen, NXP Semiconductors
2:45pm
-
3:20pm
Poster Viewing 2 and Coffee Break
3:20pm
-
4:40pm
S_06: Reliability
Chair: Bernhard Wunderle, TU Chemnitz
6:00pm
-
10:30pm
Social Event
Date: Friday, 27/Sep/2019
8:45am
-
9:30am
Keynote 3: Trends and Developments in Thermal and Mechanical Simulation of Semiconductor Devices
Chair: Claudio Maria Villa, ST Microelectronics

Dirk Schweitzer | Infineon Technologies AG
9:30am
-
11:10am
S_07: Advanced Thermal Measurement Strategies 2
Chair: Robin Bornoff, Mentor Graphics
11:10am
-
11:30am
Coffee break
11:30am
-
1:10pm
S_08: Advances in Thermal Modeling and Simulation 2
Chair: AndrĂ¡s Poppe, Budapest University of Technology and Economics
1:10pm
-
2:10pm
Lunch
2:10pm
-
3:30pm
S_09: Thermal Management in Digital Circuits, Processors, and Nanoscale Devices
Chair: Andrzej Krzysztof Tomasz Napieralski, Technical University of Lodz
3:30pm
-
3:50pm
Coffee break
3:50pm
-
4:20pm
Award Ceremony & Closing Remarks

 
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